1
PE01Y37
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ILX751B
22 pin DIP (Cer-DIP)
2048-pixel CCD Linear Sensor (B/W)
Description
The ILX751B is a reduction type CCD linear sensor
designed for facsimile, image scanner and OCR use.
This sensor reads B4 size documents at a density of
200DPI (Dot Per Inch). Featuring a shutter funcyion,
correspondences with the sensitivity correction, etc,
is possible. A built-in timing generator and clock-
drivers ensure direct drive at 5V logic for easy use.
Features
Number of effective pixels: 2048 pixels
Pixel size: 14m
14m (14m pitch)
Built-in timing generator and clock-drivers
Shutter function
Ultra low lag
Maximum clock frequency: 5MHz
Absolute Maximum Ratings
Supply voltage
V
DD1
11
V
V
DD2
6
V
Operating temperature
10 to +55
C
Storage temperature
30 to +80
C
Pin Configuration (Top View)
Block Diagram
Preliminary
1
22
V
OUT
2
NC
3
NC
4
SHSW
5
CLK
6
NC
7
NC
8
V
DD2
9
SHUT
10
NC
11
21
20
19
18
17
16
15
14
13
12
ROG
V
DD2
V
DD2
V
DD1
GND
NC
GND
NC
NC
NC
NC
GND
1
2048
22
20
17
16
15
14
13
12
10
9
11
4
21
19
5
8
7
6
3
2
1
V
OUT
Output amplifier
Sample-and-hold
circuit
V
DD2
18
NC
V
DD1
GND
NC
NC
NC
NC
GND
NC
SHUT
ROG
SHSW
V
DD2
GND
CLK
V
DD2
NC
NC
NC
NC
Clock pulse generator
Sample-and-hold pulse generator
Mode
selector
Read out gate
pulse generator
Shutter gate
pulse generator
Clock-drivers
CCD analog shift register
Read out gate
Shutter gate
D14
D15
S1
D33
S2
S2047
S2048
D34
D35
D36
D37
D38
D39
Shutter drain
2
ILX751B
Pin Description
Pin No.
Symbol
Description
1
2
3
4
5
6
7
8
9
10
11
V
OUT
NC
NC
SHSW
CLK
NC
NC
V
DD2
V
DD2
NC
ROG
Signal output
NC
NC
Switch
Clock pulse
NC
NC
5V power supply
5V power supply
NC
Clock pulse
Pin No.
Symbol
Description
12
13
14
15
16
17
18
19
20
21
22
GND
NC
NC
NC
NC
GND
NC
GND
V
DD1
V
DD2
V
DD2
GND
NC
NC
NC
NC
GND
NC
GND
9V power supply
5V power supply
5V power supply
Item
Min.
Input capacity of
CLK pin
Input capacity of
ROG pin
Input capacity of
SHUT pin
--
--
--
Typ.
10
10
10
Max.
--
--
--
Unit
pF
pF
pF
Input Capacity of Pins
Symbol
C
CLK
C
ROG
C
SHUT
Item
Min.
V
DD1
V
DD2
8.5
4.75
Typ.
9.0
5.0
Max.
9.5
5.25
Unit
V
V
Recommended Supply voltage
Item
Min.
Input clock high level
Input clock low level
Typ.
Max.
Unit
Recommended Input Pulse Voltage
4.5
0
5.0
--
5.5
0.5
V
V
Mode Description
Mode in use
Pin condition
S/H
Yes
No
Pin 4 SHSW
GND
V
DD2
Note) Rules for raising and lowering power supply voltage
To raise power supply voltage, first raise V
DD1
(9V) and then V
DD2
(5V).
To lower voltage, first lower V
DD2
(5V) and then V
DD1
(9V).
With S/H
GND
Without S/H
V
DD2
{
3
ILX751B
Electro-optical Characteristics
(Ta = 25C, V
DD1
= 9V, V
DD2
= 5V, Clock frequency = 1MHz, Light source = 3200K, IR cut filter: CM-500S (t = 1.0mm))
Item
Min.
Sensitivity
Sensitivity nonuniformity
Saturation output voltage
Dark voltage average
Dark signal nonuniformity
Image lag
Dynamic range
Saturation exposure
9V supply current
5V supply current
Total transfer efficiency
Output impedance
Offset level
Shutter lag
(30)
--
(1.5)
--
--
--
--
--
--
--
92.0
--
--
0
Typ.
40
2.0
1.8
0.3
0.5
0.02
6000
0.045
4.0
1.8
97.0
600
4.0
1.0
Max.
(50)
(8.0)
--
(2.0)
(3.0)
--
--
--
(8.0)
(5.0)
--
--
--
(5.0)
Unit
V/(lx s)
%
V
mV
mV
%
--
lx s
mA
mA
%
V
%
Symbol
R
PRNU
V
SAT
V
DRK
DSNU
IL
DR
SE
I
VDD1
I
VDD2
TTE
Z
O
V
OS
SHUT
Remarks
Note 1
Note 2
--
Note 3
Note 3
Note 4
Note 5
Note 6
--
--
--
--
Note 7
Note 8
Note)
1. For the sensitivity test light is applied with a uniform intensity of illumination.
2. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1.
PRNU =
100 [%]
The maximum output is set to V
MAX
, the minimum output to V
MIN
and the average output to V
AVE
.
3. Integration time is 10ms.
4. V
OUT
= 500mV
5. DR =
When optical accumulated time is shorter, the dynamic range gets wider because dark voltage is in
proportion to optical accumulated time.
6. SE =
7. V
OS
is defined as indicated below.
V
SAT
V
DRK
(V
MAX
V
MIN
)/2
V
AVE
GND
OS
D31
D32
D33
S1
V
OS
V
SAT
R
4
ILX751B
8. To stipulate the lag during shutter opetation, use the formula below.
Place the output voltage average value during shutter operation at V
SHUT
and the output Voltage average
value when the shutter is not in operation at V
AVE
. (Refer to Fig. 5.)
SHUT=
100 [%]
Please note that the shutter pulse at this time accord with Fig.5.
V
SAT
R
5
ILX751B
Fig.1. Clock Timing Diagram (without S/H mode)
Dummy signal (33 pixels)
Optical black
(18 pixels)
Dummy signal
(6 pixels)
Effective picture
elements signal
(2048 pixels)
1-line output period (2087 pixels)
1
D2
D3
D4
D5
D6
D11
D12
D13
D14
D15
D31
D32
D33
S1
S2
S3
S4
S2045
S2046
S2047
S2048
D34
D35
D36
S37
S38
D39
2
3
4
2087
1
2
5
ROG
CLK
V
OUT
0
5
0
6
ILX751B
Fig. 2.
CLK , V
OUT
Timing
Item
CLK pulse rise/fall time
CLK pulse duty
1
CLK V
OUT
1
CLK V
OUT
2
Symbol
t
1,
t
2
--
t
5
t
6
Min.
0
40
50
30
Typ.
10
50
80
75
Max.
--
60
110
120
Unit
ns
%
ns
ns
1
100
t
3 / (
t
3 +
t
4)
Fig. 3.
ROG,
CLK Timing
Item
ROG,
CLK pulse timing
ROG pulse rise/fall time
ROG pulse period
Symbol
t
7,
t
11
t
8,
t
10
t
9
Min.
500
0
500
Typ.
1000
10
1000
Max.
--
--
--
Unit
ns
ns
ns
CLK
t3
t4
t2
t1
t5
t6
V
OUT
ROG
CLK
t7
t11
t8
t10
t9
7
ILX751B
Fig. 4.
SHUT Timing
SHUT
t12
t14
t13
Item
SHUT pulse rise/fall time
SHUT pulse period
Symbol
t
12,
t
13
t
14
Min.
Typ.
Max.
Unit
0
500
10
1000
--
--
ns
ns
8
ILX751B
Fig.5. Shutter Operation Mode Clock
2087 bits or more
Light source
ON
1ms
5
0
ROG
5
0
CLK
5
0
During shutter lag evaluation, the light source will be accompanied by a flash.
SHUT
Illumination
9
ILX751B
ON
5V
0V
ROG
Illumination
SHUT
V
OUT
5V
0V
OFF
ON
ON
Shutter ON
V
AVE
V
SHUT
OFF
OFF
Fig.6. Shutter Pulse and Output Voltage
10
ILX751B
The charge is sent to the transfer
register as signal charge.
The charge up to this point will be thrown
away to the shutter drain.
Shutter gate ON
5V
ROG
SHUT
Accumulated charge
of the sensor
0V
5V
0V
Description of Shutter Pin 9
1) The state at 5V is when the shutter is not in operation.
2) When dropped to 0V, the shutter gate will open, letting the accumulated charge of the sensor be thrown
away to the shutter drain.
11
ILX751B
Example of Representative Characteristics
Dark signal voltage rate vs. Ambient temperature
(Standard characteristics)
10
5
1
Dark signal voltage rate
0.5
0.1
0
10
20
30
Ta Ambient temperature [ C]
40
50
60
V
DD1
, V
DD2
supply current vs. Clock frequency
(Standard characteristics)
10
I
VDD1
Ta = 25 C
I
VDD2
5
1
I
VDD1
, I
VDD2
V
DD1
, V
DD2
supply current [mA]
0.5
0.1
0.1M
1M
Clock frequency [Hz]
5M
Spectral sensitivity characteristics
(Standard characteristics)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Relative sensitivity
400
500
600
700
800
900
1000
Wavelength [nm]
12
ILX751B
Application Circuit
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
V
OUT
NC
NC
SHSW
CLK
NC
NC
V
DD2
(D)
SHUT
NC
ROG
V
DD2
(D)
V
DD2
(D)
1
5V
9V
0.01
10/16V
2SA1175
CLK
SHUT
ROG
22/10V
0.01
Output signal
3k
V
DD1
(A)
GND (A)
NC
GND (A)
NC
NC
NC
NC
GND (D)
22
21
20
19
18
17
16
15
14
13
12
1
2
3
4
5
6
7
8
9
10
11
13
ILX751B
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive
shoes.
b) When handling directly use an eath band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) lonized air is recommended for discharge when handling CCD image sensors.
e) For the shipment of mounted substrates use cartons treated for the prevention of static charges.
2) Notes on handling CCD Cer-DIP package
The following points should be observed when handling and installing Cer-DIP packages.
a) Remain within the following limits when applying static load to the ceramic portion of the package:
(1) Compressive strength: 39N/surface
(Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.)
(2) Shearing strength:
29N/surface
(3) Tensile strength:
29N/surface
(4) Torsional strength:
0.9Nm
Upper ceramic layer
39N
Lower ceramic layer
Low-melting glass
(1)
29N
(3)
0.9Nm
(4)
29N
(2)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be
generated and the package may fracture, etc., depending on the flatness of the ceramic portion.
Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic
layers are shielded by low-melting glass.
(1) Applying repetitive bending stress to the external leads.
(2) Applying heat to the external leads for an extended period of time with a soldering iron.
(3) Rapid cooling or heating.
(4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as
tweezers.
(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.
Note that the preceding notes should also be observed when removing a component from a board after
it has already been soldered.
3) Soldering
a) Make sure the package temperature does not exceed 80C.
b) Solder dipping in a mounting furnace causes demage to the glass abd other defects. Use a 30W
soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,
cool sufficiently.
c) To dismount image sensors, do not use a solder suction equipment. When using an electric desoldering
tool, ground the controller. For the control system, use a zero cross type.
14
ILX751B
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface blow it off with an air blower. (For dirt stuck through static electricity, ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch
the glass.
d) Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage
in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
15
ILX751B
Son
y Cor
por
ation
Package Outline Unit: mm
1. The height from the bottom to the sensor surface is 2.45 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
V
H
7.35 0.5
22
28.672 (14m X 2048Pixels)
41.6 0.5
1
11
12
No.1 Pixel
5.0
0.5
4.0
0.5
2.54
0.51
3.65
4.35
0.5
0.25
0
to 9
10.0
0.5
0.3
22 pin DIP (400mil)
M
Cer-DIP
TIN PLATING
42 ALLOY
5.20g
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
LS-A18-01(E)
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